adCLUSTER
With the Adenso VAC.ROBOTICS platform you create complex vacuum systems, especially DUAL.CLUSTERS, and thus double your vacuum process area. Our LINK.Modules connect individual cluster tools to form a large vacuum area. adCLUSTER thus enables the processing of substrates in significantly more process stations than usual, on a minimum footprint – and does so without leaving the vacuum room, i.e. without any influence of oxygen, moisture, particles, etc.
Your advantages
- Connection of multiple cluster tools by LINK.Modules
- Additional ports and thus significantly more processes in the smallest space
- Substrate handling in the same vacuum room – no contact with oxygen or moisture between different process flows
- adCLUSTER uses the open, hardware-independent and flexible structure of the Adenso Cluster.Operating system
- uncomplicated expansion of the tool via adControl
LIM Link.Modules
The Adenso LIM Link.Modules enable the WHM WaferHandling.Module to be connected to peripheral equipment (atmospheric or under vacuum) for the setting up of a DUAL.CLUSTER or MULTI.CLUSTER. You therefore easily expand your existing cluster tool and double your process capacity, throughput and effectiveness! Optional expandable with heating and pressure control technologies
DLM DualLink.Modules
The Adenso DualLinkModules are special angled Link.Modules for connecting a WHM WaferHandling.Module to peripheral equipment such as front end modules (EFEM). The equipment mostly includes a TURN rotary unit. These modules can also be complemented with various optional substrate heaters and vacuum pressure controls
