Skip to content Skip to footer
Adenso.Solutions
Adenso.Solutions
Close
About us

Innovative Robot.Solutions
 from Silicon Saxony

Adenso has specialised in the development, setup and delivery of modular Robot.Solutions for high-vacuum environments.

The Saxon company can look back on a long, successful history:
Founded in 1998 by Dipl. Ing. Uwe Beier, Adenso initially started in engineering and established itself in the coming years as a plant builder and a developer of handling systems for the optics, solar and semiconductor industry. Today the company has developed into an around 50-person VAC.ROBOTICS company with experts with backgrounds in mechanical engineering, electrical engineering and software engineering and develops and supplies worldwide industrial customers with tailored solutions.

Experience since
80808080
Projects
808080+
adBox-Adenso-gebaude_opt
AdensoRobotConfigurator-ARC_opt
Experience

Our Adenso.History

2025

Development of MULTI.IMP - advanced Implanter.Scanner solutions

2024

Ultra-high vacuum (UHV) expansion of the VAC.ROBOTICS platform

2023

  • Linking multiple WHM WaferHandling.Modules to adCLUSTER tools
  • Temperatures in adHEAT modules up to 1,000°C for the silicon carbide industry

2022

Development of the adVAC and adJET Processing.Modules for pressure control within the cluster tool and at the device under test (DUT)

2021

2020

2019

  • Focus on IMP Implanter.Solutions
  • Opening of the new production building

2018

  • Introduction of adCONTROL as a Software.Solution for the control of the VAC.ROBOTICS platform
  • Development of HOT.TRANSFER modules for the integrated transport of preheated substrates

2017

Development of the FLP FOUP300 VAC.LOADPORT enables the direct loading of 300mm wafers from the FOUP in the vacuum environment

2016

Expansion of the VAC.ROBOTICS platform to include many vacuum functions Focus on the processing of ultra-thin glass (UTG)

2015

Expansion of the VAC.ROBOTICS platform to include many vacuum functions Focus on the processing of ultra-thin glass (UTG)

2014

Start of series production of the WHM WaferHandling.Module

2013

Introduction of the VAC.ROBOTICS platform

2012

Establishment of the WHR WaferHandling.Robot for the semiconductor industry

2011

Development of the first adHEAT modules for temperature control of substrates

2010

Vacuum processing of thin glass substrates

2009

STEALTH.CARRIER solutions for substrate temperature control

2008

Foundation of Adenso GmbH and opening of the office in Dresden

2005

Development of test systems for ultra-thin semiconductor substrates

2003

Entry into the development of carrier systems for the semiconductor industry

2002

Development of cryo test systems and cryo stores for semiconductor substrates

2000

Opening of the first office in Ottendorf-Okrilla

1998

Foundation of Beier Constructions
Our values

Tailored solutions from experts - your advantages

efficient

Time saving and efficiency increase for wafer and carrier handling
WHM WaferHandling.Module

load-bearing

Maximum load capacities and extreme ranges with Adenso.WHR-VAC wafer handling robots
WHR WaferHandling.Robot

controlled

Object and event-oriented programming and hardware-independent operating system
adCONTROL

access-ready

Location-independent online accesses to relevant system documentation over the ToolCloud
ToolCloud

practical

Broad installation base: 200 tools, of which, 98 percent in 24/7 production

individual

Greatest flexibility through customised configuration

networked

Worldwide delivery

ready for use

Immediate use with the suitable interfaces for your existing processes
Jobs

You would like to start your professional future with us?
Then come this way…

Career

Privacy policy | Imprint

Go to Top