LLM LoadLock.Modules
Our Adenso LLM 230/330 LoadLock.Modules enable loading of multiple substrates with a MAG magazine or WaferCassette under vacuum environment. All ports of the WaferHandling.Module are equipped with a lockable GATE to keep individual modules separate from each other in vacuum terms. Our WHR WaferHandling.Robot access the respective substrate via this gate valve.
The Adenso Loadlock.Modules
for research and production:
- Semiconductors: Wafers, masks, carriers
- Material research
- Surface analysis
- Nano- and biotechnology: Sample holder
- Sensors
- Optics
- Photovoltaics: Solar cells
- Device test
Your advantages
- Latest technologies
- Compact and stable design
- Low acquisition costs
- User friendly
- Various configuration options
- High productivity and reliability
- Immediate usability
- Ergonomic design
- Integration support
tailored for research and production
The LLM330 LoadLock.Module is a tailored carrier storage system for research and production. Based on a vertical lifting unit, the module enables continuous substrate handling and thus ensures constantly running processes. The LLM330 load lock module can be used for fully automated loading and unloading of between 5 and 50 substrates/carriers. Weights of more than 10kg per carrier are possible.
- Also usable as a BUFFER.Module
- Optionally with adHEAT heating and cooling options and special adVAC pressure control
MLL ManualLoadLock.Modules
The Adenso MLL 200/300 ManualLoadLock.Modules are suitable for feeding plants with individual substrates or individual wafer carriers as well as small MAG magazines with up to 5 substrates.
- Also usable as a BUFFER.Module
- Optionally with adHEAT heating and cooling options and special adVAC pressure control
ALM AutoLoad.Modules
The Adenso ALM 230X AutoLoad.Modules close the process gap between manual loading solutions and fully automated WaferHandling.Robot systems. Fast, streamlined, independent, suitable for high-vacuum and cleanroom.
Your advantages
- Process reliability: high-precision and space-saving kinematics, Substrate.Mapping, ID reader for magazine identification
- Flexibility: customised integration of different test devices, image processing systems, substrate alignment of different cassette types
- Suitable for substrates up to 200 mm, round and square type
- ToolCloud: The Adenso.ToolCloud manages and monitors all Adenso.Solutions from the start of the project through to actual production
adLOAD | advanced High.Capacity LoadLock.Modules
The Adenso adLOAD LoadLock.Modules offer an enormously high substrate capacity for cluster tools. 30, 40, 50 and more wafers per cycle can be accommodated in a LoadLock – an enormous increase in the autonomous time with the same footprint.
Your advantages
- Compatible with all options of the Adenso VAC.ROBOTICS platform
- Combinable with alignment, multisubstrate gripper, temperature control, etc.
- Also configurable with a substrate size of 200 and 300 mm
- Combination with all central platforms for future-proof flexibility of all applications
- Configure now!
FLP FOUP300 VAC.LOADPORT
The patented Adenso FOUP300 VAC.LoadPort enables direct loading of a FOUP (front opening universal pod for 300mm wafers) into a vacuum environment,
allowing the vacuum robot to have direct access to the wafers inside the FOUP.
This results in significant savings in cleanroom space and operating costs, since neither an ATM robot nor an EFEM is needed anymore.
With regard to AMC (Airborne Molecular Contamination), this solution offers significant advantages, since the high-vacuum environment present here inherently eliminates these hazards (unlike atmospheric systems).
- No atmospheric robot handling / EFEM necessary
- Saves up to 80% cleanroom space
- Suitable for LAB applications and medium-volume production
adDOCK - automated dock/undock of loadlock modules for easy service access
Maintain a full equipped cluster tool could be difficult, for example an 8port central robot handling module with a loadlock and 7 process modules.
The (well-intentioned) reasons for the difficulties are usually as follows:
- a desire to make maximum use of the floor space
- the need for fixed piping for the process gasses
- the use of a rigid mainframe without adequate service access points
The priorities are usually clear:
- Process technology is clearly the top priority.
- Substrate handling is of secondary importance.
This line of reasoning already dictates the solution:
Using a flexible, central robot WaferHandling.Module that allows access for maintenance work by (temporarily) removing a loadlock module – without the need to disconnect the media connections.
The use of a semi-automatic docking solution known as adDOCK makes it very easy to uncouple and move away a loadlock – within the designated service areas, without using tools and without the need for lifting equipment.
- Semi automatic solution – no tools, no media disconnection
- Unprecedentedly generous service access to the central robot module
- Saves an incredible amount of service time and significantly reduces risks