Optional Pre- and Post-Processing.Modules
As additional system components of the Adenso VAC.ROBOTICS platform, Adenso offers further optional pre- and post-processing modules for the temperature control of substrates of any size and for precise pressure control.
adHEAT | advanced heating solutions
Numerous processes, such as in SiC technology (silicon carbide), require high process temperatures (> 1,000°C). Untempered substrates require a long heating time. Optimize your processes and save valuable process time with adHEAT. Our HEATING/COOLING.modules can be easily docked onto the Adenso VAC.ROBOTICS platform and are ready for immediate use.
Your advantages
- Simple integration in the Adenso VAC.ROBOTICS platform
- Process optimisation through time savings
- COOLING.Module: Cooling of substrates after thermal processes
- HEATING.Module: Heating of substrates as process preparation
- adHEAT.1kC enables substrates or carriers to be preheated to the required temperature of up to 1,000°C
- Process control by the Adenso cluster Software.Solution adControl
adVAC
advanced Vacuum Pressure Control
adVAC – our solutions for precise pressure control within the cluster system and its individual chambers. Adenso provides solutions that are individually tailored to customer processes.
adJET
advanced DUT pressure control
adJET – our solutions for the targeted provision of special pressure values directly at the Device Under Test (DUT). Gases or gas mixtures can be fed directly to the substrate via a nozzle, independently and separately from their vacuum environment, without spreading in high concentrations in the surroundings.
STEALTH.CARRIER
Suitable for all substrates:
- 50, 100, 150, 200 and 300mm wafers
- Glass, ceramic, sapphire substrates,
- devices, individual chips, etc.