WHM modules
Special handling units for extremely sensitive substrates
Rely on the proven handling solutions of the Adenso VAC.ROBOTICS platform and be prepared for rapidly increasing customer and process requirements
Module
ULTRA THIN wafer/substrate HANDLING solutions
Substrates are getting thinner and thinner – and customer and process requirements are increasing rapidly!
Be prepared with Adenso’s UTH solutions – based on the VAC.ROBOTICS platform, which allows you to use all the familiar features:
- align
- flip
- bond
- heat
- ...
ATM and VAC versions available.
What tasks do you have lined up at the moment?
Module WAM
Your Benefits
- Easy integration into the Adenso VAC.ROBOTICS platform
- Time savings through process optimization
- Process control using Adenso Cluster Software.Solution adControl
- align - center position and angle
- flip - turning substrates over inside vacuum enviroment
- combine - wafer/wafer or wafer/carrier
- heat - conditioning and annealing