One hundredth delivery of a module for carrier-bound substrate handling
The Adenso has now handed over the 100th tool for carrier-bound substrate handling to a customer!
This product is part of the Adenso VAC.ROBOTICS platform, in which customer substrates such as wafers are transported between the process modules in special carriers.
This takes place in a high-vacuum environment, as the processes require this and the sensitive substrates are thus protected along the transport path from the influences of the ambient air, such as particles, moisture, oxygen, ….
To complement this type of system, the Adenso team supplies Wafer Handling.Modules for carrierless transport of round and square 200 and 300mm wafers and for all types of customised special substrates.
Apart from worldwide unique solutions such as FOUP vacuum direct access and multisubstrate grippers, the special features of the Adenso VAC.ROBOTICS platform are above all the enormous range and load capacity of the Adenso.Robot solutions.
A decisive factor is the Adenso.TEAM which, working in friendly collaboration acts extremely flexibly and in doing so ensures consistent top quality. In addition there is the willingness to respond to the wishes of our customers and to do so by quickly finding suitable and innovative solutions.