Optional Pre- and Post-Processing.Modules
As additional system components of the Adenso VAC.ROBOTICS platform, Adenso offers further optional pre- and post-processing modules for the temperature control of substrates of any size and for precise pressure control.
adHEAT | advanced heating solutions
Numerous processes, such as in SiC technology (silicon carbide), require high process temperatures (> 1,000°C). Untempered substrates require a long heating time. Optimize your processes and save valuable process time with adHEAT. Our HEATING/COOLING.modules can be easily docked onto the Adenso VAC.ROBOTICS platform and are ready for immediate use.
Your advantages
- Simple integration in the Adenso VAC.ROBOTICS platform
- Process optimisation through time savings
- COOLING.Module: Cooling of substrates after thermal processes
- HEATING.Module: Heating of substrates as process preparation
- adHEAT.1kC enables substrates or carriers to be preheated to the required temperature of up to 1,000°C
- Process control by the Adenso cluster Software.Solution adControl
adVAC
advanced Vacuum Pressure Control
adVAC – our solutions for precise pressure control within the cluster system and its individual chambers. Adenso provides solutions that are individually tailored to customer processes.
adJET
advanced DUT pressure control
adJET – our solutions for the targeted provision of special pressure values directly at the Device Under Test (DUT). Gases or gas mixtures can be fed directly to the substrate via a nozzle, independently and separately from their vacuum environment, without spreading in high concentrations in the surroundings.
STEALTH.CARRIER
Suitable for all substrates:
- 50, 100, 150, 200 and 300mm wafers
- Glass, ceramic, sapphire substrates,
- devices, individual chips, etc.
Implanter.Module
Ion implantation is used in the semiconductor industry to implant (insert) different types of ions with different energies into substrates such as wafers (for doping, creating of planned shortcuts, etc.).
This enables targeted changes to the properties of the base material and/or the layers that have already been applied.
Adenso offers customer-specific implant modules (IMP) as part of the modular VAC.ROBOTICS platform - which enables customers to set up new implanter systems and apply and develop new ion implantation technologies quickly and easily.
For new ion implantation processes such as superjunction technologies for SiC (silicon carbide) MOSFETS up to 3.3kV, the compact implanter modules from Adenso, which have already been proven in industrial series production, are ideally suited for high volume manufacuring, especially in conjunction with the SubstrateScanner.Solutions for precise scanning movements of the SiC substrates/wafers in the ion beam.
Supplemented with a heating chuck up to 1.000°C, there is a significant increase in throughput.
Further options include a wide range of beam controls, calibration equipment and measurement technology. In many cases (e.g. with SiC MOSFETS) these enable the reduction to fewer implantation stages, which means significant cost savings and increased throughput.
Applications for such silicon-carbide based MOSFETS on SiC superjunction technology are diverse: automotive drivetrains, EV charging, solar energy systems, energy storage, high-power traction inverters etc.
The WHM-IMP.Module is designed for substrate dimensions of up to 300 or 200mm, on which wafer sizes of 150/100/75/50/25mm can also be processed.
Direct substrate handling as well as carrier solutions are available for all substrate sizes and dimensions (round, rectangular, special)
- flexible, customer-specific configuration, based on industrial-prooved solutions
- fast commissioning based on modular hardware and software concept
- integration of customers ion implantation technologies and measurement equipment
SSS SubstrateScanner.Solutions
The following special features are particularly valued by Adenso.Implanting customers
- vertical.scanner – for fast and high precise substrate movements, in case the ion beam can only be formed in one dimension
- DUAL.SCAN Solution – comes with two scanning modules – for highest thruput and/or filter/substrate combinations
- active-/passive-substratt – beam filter technology
- heat/cool – chuck systems available (up to 1.000°C)
The Adenso Scanner.Solutions are ideal for processing SiC wafers (silicon carbide), especially in combination with the heating chuck up to 1,000°C
New technologies such as SiC superjunction for SiC MOSFETS can be precisely processed and further developed on industrially proven Adenso solutions.