The trend toward increasingly thin, large-format, and increasingly rectangular substrates poses new challenges for the high-tech industry. Especially in future markets such as OLED technologies and quantum computing, the demands for precise, safe, and process-stable handling are increasing significantly.
To meet these developments, Adenso is expanding its portfolio with a specially configured panel handling robot that is precisely tailored to these new requirements.
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To keep pace with these developments, Adenso is expanding its portfolio with a specially configured PHM Panel Handling Robot that is precisely tailored to these new requirements.
Optimized handling for large, sensitive substrates
The new Panel Handling Robot was developed to reliably move substrates with sensitive surfaces, large dimensions, and minimal material thicknesses. Thanks to its robust yet highly precise kinematics, it enables gentle manipulation of even highly sensitive panels.
Seamless integration into the VAC.ROBOTICS platform
Like all Adenso solutions, the Panel Handling Robot can also be fully integrated into the modular VAC.ROBOTICS platform.
It is compatible with all known function modules, including
Alignment.Module – For precision alignment
WFM WaferFlip.Module – For flipping substrates
LIM Link.Module – Connection to peripheral equipment and setup of a DUAL.CLUSTER or MULTI.CLUSTER
HEATING/COOLING.Module – Contactless temperature control and efficient substrate cooling
Developed for future technologies
The demand for high-performance handling systems is growing—especially where large-format panels are processed and maximum cleanliness, repeatability, and temperature stability are required.
With the PHM Panel Handling Robot, Adenso responds to precisely these requirements and provides a solution that is process-stable, scalable, low-maintenance and future-proof.
